摘要
温度是三维(3D)集成的重要设计约束,温度场可视化对于3D芯片热设计与任务调度等工作具有重要意义。为了对3D芯片温度分布进行实时可视化分析,开展了如下研究:使用连续过松弛(SOR)算法进行并行全芯片热分析,仿真出3D温度场;利用颜色映射技术在温度场与颜色之间建立起对应关系,以实现数据的可视化;基于CUDA架构,使用GPU众线程大规模并行绘制技术,对3D温度场实时绘制进行了加速研究;将以上研究集成为一个3D温度场实时可视化原型系统。大量实验表明:3D芯片温度场实时可视化系统能够提供实时的动态可视化温度分析,与CPU绘制相比,基于CUDA的GPU绘制可以获得86倍的加速。
Temperature is one important design constraint in three -dimensional （3D） integration. The visualiza- tion of temperature field has an important significance for 3D - Chip thermal design and task scheduling. In order to analyze the temperature distribution on 3D -Chip in real -time visualization, this work has carried out following re- searches： Successive over relaxation （SOR） algorithm is used to parallel the full -chip thermal analysis, and simu- late the 3D temperature field; The color mapping technology is used to establish corresponding relationship between the temperature field and color, and to realize the visualization of data ; With GPU many threads, CUDA -based massively parallel rendering technology is used to accelerate the real - time rendering of 3D temperature field ; The a- bove researches are integrated into a real -time visualization prototype system of 3D temperature field. A large num- ber of experiments show that the real - time visualization system of 3D - Chip temperature field can provide real - time dynamic visual temperature analysis. Compared with CPU rendering, CUDA -based GPU rendering can achieve 86 times acceleration.
出处
《计算机仿真》
CSCD
北大核心
2015年第8期289-293,共5页
Computer Simulation
基金
国家自然科学基金(61274033
61271198
61301146)
国家"八六三"高技术研究发展计划(2009AA01Z126)
关键词
三维芯片
科学可视化
并行绘制
3D chip
Scientific visualization
Parallel rendering
