摘要
使用正交优化试验,研究了UV激光参数与刚挠结合印制电路板中铣槽精细控深能力的关系。实验结果表明,UV激光工艺参数对切割能力影响的因素优先级依次为:激光功率-激光频率-Z轴高度-光斑直径,获得切割深度最大为追求目标的最优因素水平组。
Using orthogonal testing optimum design, the relations between the cutting slot depths and U V laser parameters in Rigid-Flex PCB was studied. The experimental results showed that the priority order of the factors affecting the slot depths were laser power, laser frequency, height of Z axis, spot diameter in sequence. The max-depth was obtained by the UV laser cutting with the optimized parameters.
出处
《印制电路信息》
2015年第5期22-24,共3页
Printed Circuit Information
基金
广东省2013年重大专项的资助(项目编号:2013A090100005)