摘要
芯片研发企业对项目的管理,目前仍以进度流程和经费被动管理为主,未建立项目风险管理体系,往往出现预算超支、工期延长等问题。项目风险管理中最重要最基本的是风险识别。通过某国家重大专项风险识别的案例,说明如何在芯片研发项目中运用WBS-RBS矩阵进行风险识别的全过程。
The paper put forward a novel risk identification methodology of coupled WBS-RBS matrix to identify in advance and effectively avoid the potential ventures during the development of integrated circuit products. Based on the methodology, relevant regulations are draw up systematically and applied to monitor the national science and technology major project of China.
出处
《电子与封装》
2015年第5期45-48,共4页
Electronics & Packaging
