摘要
针对应用于电子芯片的矩形通道翅片散热器换热性能的不足,提出了一种新型打断翻折型翅片散热器,并对两种散热器单通道内的流动换热进行CFD数值模拟。本文综合分析了f、j、无量纲因子(j/f)1/3和δ等参数,证明了打断和翻折翅片可以减薄边界层厚度、促进流体扰动和强化对流换热的效果。根据场协同理论和广义温度梯度均匀化原则,深层挖掘强化换热的内在规律;证明新型结构优于矩形结构,为用散热器冷却电子芯片提供了参考。
Aiming at the insufficient heat exchange performance of rectangular channel fin heat sink for electronic chips, a new heat sink with interrupted and folded fins was proposed. Numerical simulations on the flow and heat transfer of air in single flow channel for the two kinds of heat sink mentioned above were performed. The parameters of f j, dimensionless factor （j/f）^1/3 and δ were comprehensively analyzed, and the results show that interrupted and folded fms can make fluid boundary layer thickness thinner and promote disturbances, thus the convection heat transfer was enhanced. According to field synergy theory and generalized temperature gradient uniformity principle, the inherent laws of heat transfer enhancement was deeply excavated. The new structure is proved to be superior to the rectangular structure. Moreover, the result provides a reference to the design of heat sink for cooling the electronic chips.
出处
《制冷技术》
2015年第1期36-40,共5页
Chinese Journal of Refrigeration Technology
关键词
CPU芯片
对流换热
数值模拟
场协同理论
CPU chip
Convective heat transfer
Numerical simulation
Field synergy theory
