摘要
PCB过孔与连接器的连接品质极大的影响阻抗一致性及信号完整性,因此压接孔孔径公差要求非常高。文章即是在此背景下,针对性实验测试各工序对孔径的影响规律,然后再结合统计理论和误差分析,界定了成品孔径公差能力并给出工艺控制方法。
The connection quality between connector and via-hole has a great impact on impedance of via and signal integrity. Therefore it should be assured that high requirement for aperture tolerance of crimping hole. Based on above background, this paper focus on study how each process infiuences the aperture tolerance through experimental tests, and then combined with statistical theory analysis, to define the capability offinished aperture tolerance and put forward process control method. The results of this study will provide technical support for manufacturing of high frequency and high-speed PCB product with high performance requirements of via-holes.
出处
《印制电路信息》
2014年第11期19-22,共4页
Printed Circuit Information
关键词
孔径公差
孔径补偿
误差传递
能力水平
Aperture Tolerance
Aperture Compensation
Deviation Metastasis
Capacity Level
