摘要
利用共沉淀法分别制备丁酸乙酯与β-和γ-环糊精包合物。正交试验表明:制备β-环糊精包合物的最佳参数为,丁酸乙酯与β-环糊精的摩尔比为1∶1、超声30 min、超声温度50℃,可获最大包合率为46.69%;制备γ-环糊精包合物的最佳参数为,丁酸乙酯与γ-环糊精的摩尔比为1∶1、超声45 min、超声温度60℃,可获最大包合率为95.59%。通过扫描电镜、红外及X-衍射对包合物的分析,证明了丁酸乙酯与2种环糊精包合物的形成。综合结果显示,γ-环糊精更适合包埋丁酸乙酯类风味小分子。
Co-precipitation method was used to prepare the inclusion complexes of ethyl butyrate with β-and γ- cyclodextrin. The optimal inclusion conditions were determined by orthogonal array design experiments. The results showed that the inclusion ratio of β-cyclodextrin complex could reach to 46.69 % when ethyl butyrate/β-cyclodextrin molecular ratio was 1 ： 1, ultrasound time was 30 min and ultrasound temperature was 50 ℃. The inclusion ratio of γ- cyclodextrin complex could reach 95.59 % when ethyl butyrate/γ-cyclodextrin molecular ratio was 1 ： 1, ultrasound time was 45 min and ultrasound temperature was 60 ℃. The interactions between ethyl butyrate and cyclodextrins were analyzed by scanning electron microscope （ SEM）, infrared spectrometry （IR） and X-ray diffraction （XRD）. The complexes formation was confirmed, and γ-cyclodextrin was more suitable for wall material of ethyl butyrate.
出处
《食品与发酵工业》
CAS
CSCD
北大核心
2014年第9期34-38,共5页
Food and Fermentation Industries
基金
国家自然基金(31271960)资助
关键词
环糊精
丁酸乙酯
包合物
正交试验
表征
cyclodextrin, ethyl butyrate, inclusion complexes, orthogonal array design, characterization
