摘要
在壳聚糖微球上引入孔隙和多胺化基团,以Cu2+为印迹分子、戊二醛为交联剂,采用离子印迹技术制备多孔多胺化壳聚糖印迹微球(AP-CSMIP),研究其对Cu2+的吸附性能。结果表明,AP-CSMIP对Cu2+的吸附条件为:pH=5.0,300mg/L的Cu2+溶液25mL,吸附剂投加量为0.07g,振荡吸附8h,吸附量可达到48.46mg/g;AP-CSMIP对Cu2+的吸附更好地符合准二级动力学模型,吸附由化学反应控制,而非扩散控制;与非印迹吸附剂相比,AP-CSMIP的吸附量大大提高,具有较高的实用价值。
Pores and polyamine group were Introduced in the chitosan microspheres. Amin- ated porous chitosan imprinting microspheres （AP-CSM/P） were prepared by ion imprint- ingtechnology, which was based on Cu2＋ as imprinted ions and glutaraldehy as cross-linking agent and evaluated the adsorption conditions on Cu2＋. The results showed that the maxi- mum adsorption capacity for Cu2＋ was 48.46mg/g at initial concentration of Cu2＋ solution 300mg/L 25mL, pH = 5.0 for 8h by 0. 07gAP-CSMIP. The adsorption of AP-CSMIP on Cu2＋ could be fitted with a pseudo-second order equation which was controlled by chemical reaction, rather than spread control. Compared with non-imprinted adsorbents, AP-CSMIP gets a higher adsorption capacity and better practical value.
出处
《沈阳理工大学学报》
CAS
2014年第5期38-41,共4页
Journal of Shenyang Ligong University
关键词
壳聚糖
印迹
铜
吸附
chitosan
imprinting
copper
adsorption
