摘要
采用三元Ag-Cu-Ti活性焊料对碳化硅陶瓷进行电阻钎焊,利用电子显微镜观察分析连接界面微观结构。在界面观察到了反应层生成。在试验条件下,反应层由靠近焊料的Ti5Si3和靠近SiC侧的TiC组成,反应层厚度随焊接区温度的增加而不呈单调增加。在焊接电流上升速率为17 A/s时,接头界面反应层厚度仅为15nm。实验结果表明,以Ag-Cu-Ti合金为焊料在大气中能够实现碳化硅陶瓷的电阻钎焊。
Carborundum sheets were bonded by electric resistance brazing with Ag-Cu-Ti solder,and the Interracial microstructure of joint was observed using a transmission electron microscope. The reaction layer,which consisted of Ti5Si3 adjacent to solder and TiC adjacent to carborundum,was observed in the bonded interface. The thickness of reaction layer was not a monotone increasing with the increase of the temperature. The thickness of reaction layer was 15 nm when the rate of welding current rise was 17 Ms. The results reveal that the electric resistance brazing of carborundum can be achieved in the atmosphere with Ag-Cu-Ti solder.
出处
《电焊机》
北大核心
2014年第9期39-41,76,共4页
Electric Welding Machine
基金
河南省高校科技创新团队支持计划资助项目(13IRTSTHN003)
河南省教育厅科学技术研究重点资助项目(14A460016)
关键词
微观组织
电阻钎焊
碳化硅
microstructure
electric resistance brazing
carborundum
