摘要
采用镍基中间层合金,在真空钼丝炉中对第二代镍基单晶高温合金DD6进行了瞬时液相扩散焊（TLP焊）连接,焊接温度为1200℃、保温时间为12h。用标准热处理制度对其接头进行热处理,分析了热处理工艺对接头组织的影响规律。结果表明,设计的中间层合金熔点在1084-1095℃范围,组织细小均匀,满足DD6单晶的扩散连接需要;TLP焊焊缝组织由γ相和γ′相组成,无片状共晶组织形成;焊缝金属与母材结合良好,经标准热处理后γ′相发生明显的晶粒长大和立方化,并以典型的立方形形貌均匀弥散地分布于基体之中,形成了微观结构理想的扩散连接接头。
The TLP bonding of DD6 single crystal superalloy was conducted in vacuum molybdenum wire fumace, usingnickel-based interlayer alloy, and the bonding parameter is 1200℃ for 12h. The heat treatment was carried out under standardheat treatment regime for DD6 superalloy. The effects of heat treatment on the microstructure of the welded joint wereanalyzed. The results show that, the melting point of designed interlayer alloys with fine and uniform microstructure is at1084-1095 ℃ ,which can realize the bonding of the DD6 alloy. The microstructure of TLP bonding seam consists of γand γ′phases without the formation of eutectic microstructure, and the welded metal has good combination with base metal, whichmay undergo apparent grain coarsening and cube transition, and then, the grain uniformly distributes in matrix by typical cubemorphology by the standard heat treatment, resulting in the formation of diffusion bonding joint with ideal weldingmicrostructure.
出处
《热加工工艺》
CSCD
北大核心
2014年第17期29-33,共5页
Hot Working Technology
基金
西安市产业技术创新计划项目(CX12154(2)
CX12180(3))
西部材料创新基金资助项目(XBCL-1-12)
关键词
DD6单晶
中间层合金
TLP焊
微观组织
DD6 single crystal superalloy
interlayer alloy
TLP bonding
microstructure
