摘要
化学机械抛光(Chemical mechanical polishing,CMP)材料去除及负载特性主要受界面摩擦影响。对旋转型CMP系统进行了运动学和动力学分析,由此建立了CMP设备抛光界面摩擦负载(包括摩擦力矩和摩擦径向力)表达式。系统研究了CMP设备抛光头&抛光盘主体结构负载特性随运动参数的变化规律,发现抛光头/盘转速比对负载影响最为明显:随转速比的增加,抛光头所受摩擦力矩增加,抛光盘所受摩擦力矩减小;且对抛光头而言存在值为1的临界转速比,当转速比小于1时,摩擦力矩对抛光头为驱动力矩;实际工况下转速比接近1时,抛光头所受摩擦力矩几乎为零,因相对运动而产生的摩擦负载主要由抛光盘承载。在此基础上,采用商用有限元分析软件建立了抛光盘及转子有限元模型,分析了抛光盘在螺钉预紧力、偏心轴向力和摩擦力矩复合载荷作用下的变形特性,为CMP装备设计提供了依据。
Interface friction affects the material removal and load characteristic of chemical mechanical polishing （CMP）. The kinematic and dynamic analysis is performed for rotary type CMP system. Based on which, the expression of the interfacial friction load （including the friction torque and the friction radial load） is deduced. The laws of the load characteristic of the carrier ＆ platen main structure variation with the kinematic parameters are investigated, which suggests that the speed ratio gives the most obvious effect on the load. With the increasing of speed ratio, the friction torque of the carrier increase, while the friction torque of the platen decrease. And there is a critical speed ratio with the value of 1 for the carder. When the speed ratio is below 1, the friction torque appears driving torque for the carder. In actual condition, the speed ration is close to 1, therefore, the friction torque of the carder is nearly zero. As a result, the interface friction torque caused by the relative motion is mainly loaded by the platen. Further, a finite element analysis （FEA） model of the platen and the rotor is constructed using commercial FEA software. The deformation of the platen surface under the combined load of tightening torque, eccentric axial load and friction torque is analysed, which provides a reference for the design of CMP equipment.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2014年第15期160-165,共6页
Journal of Mechanical Engineering
基金
国家科技重大专项(2008ZX02104-001)
国家自然科学基金(51305227)
中国博士后科学基金(2012M520251)资助项目
关键词
化学机械抛光
动力学
摩擦力矩
有限元
抛光盘
chemical mechanical polishing
kinetics
friction torque
finite element analysis
polishing platen
