摘要
以316L不锈钢为基体,分别采用脉冲电镀和直流电镀法制备了钯膜层。对比研究了脉冲电镀钯和直流电镀钯的微观结构、显微硬度、孔隙率、耐蚀性等性能。与直流电镀钯膜层相比,脉冲电镀钯膜层更为均匀、致密,晶粒尺寸更小,孔隙率更低,显微硬度更高,附着力更强。另外,脉冲电镀钯膜层在80°C的20%H2SO4和20%H2SO4+0.001 mol/L Cl-中的耐腐蚀性均优于直流电镀钯膜层。
Palladium films were prepared on 316L stainless steel substrates by pulse and direct current plating, respectively. The properties of the palladium films prepared by pulse and direct current plating such as microstructure, microhardness, porosity, and corrosion resistance were comparatively studied. It is indicated that the pulse current plated palladium film has more uniform and compact surface, smaller crystal size, lower porosity, higher microhardness, and stronger adhesion than the direct current plated palladium film. The corrosion resistance of the pulse current plated palladium film in both 20% H2SO4 and 20% H2SO4 ＋ 0.001 mol/L Cl^- solutions at 80 ℃ is superior to that of the direct current plated one.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第16期677-680,共4页
Electroplating & Finishing
基金
国家科技支撑计划(2012BAE04B01)
关键词
不锈钢
钯
脉冲电镀
微观结构
耐蚀性
stainless steel
palladium
pulse current plating
microstructure
corrosion resistance
