摘要
通过对电子设备模块内芯片的传热路径分析,建立了模块结构件与机箱导轨接触热阻测试系统,测量并计算出模块结构件与机箱导轨之间的接触热阻,并且得出在工程实际中6061铝合金固体—固体界面间接触热阻与模块功耗的关系,为后续设计计算、仿真提供了依据。
The lest system of the contact thermal resistance between the model of electronic device anti the guide rail of chassis was established by analyzing the Ilea! transfer load of the electronic model chip. The contact thermal resistam＇e between the model of electronic devi（＇e and the guide rail of chassis was obtained bv test and ealculalion. The relationbetween the contact resistances of aluminunm 6061 solid-solid interface and the module power dissipalion was given for the future design and simulation.
出处
《机械工程师》
2014年第7期58-59,共2页
Mechanical Engineer
关键词
接触热阻
6061铝合金
测试
contact thermal resistance- aluminum 6061
test
