摘要
集成电路制造技术的迅速发展已经可以把一个完整的电子系统集成到一个芯片上即所谓的系统级芯片 (Sys tem on Chip ,简称SoC)。传统的设计方法是将硬件和软件分开来设计的 ,在硬件设计完成并生产出样片后才能调试软件。本文介绍了针对于系统级芯片设计的软硬件协同设计技术 (co design)的概念和设计流程 。
Due to the development of IC technology, now a complex electronic system can be integrated in a chip called system on chip (SoC). This paper introduced the traditional IC design methodology for SoC, and also discussed the concept and design flow of software/hardware co design of SoC.
出处
《电子器件》
CAS
2002年第2期183-186,共4页
Chinese Journal of Electron Devices
