摘要
在1150—1250℃的范围内研究了Cu_2S与Cu_20交互反应的动力学,反应速率随Cu_2O颗粒表面积的增加而增加,温度的影响不明显。假设氧通过反应边界层液膜中的扩散是交互反应速率的控制步骤,最终动力学方程为α=6.69×10^(-2)At (0<α<0.74) In(1-α)=-A(9.83×10^(-2)t+1.76)(0.74<α<1)
Interaction of Cu_2S with Cu_2O was investigated in the range of 1150 to 1250℃. The reaction rate increases with the increasing of surface area of Cu_2O grains and depends unobviously on the temperature. At the suggestion of the controlling step of reaction rate being oxygen diffusion through the liquid layer along interaction boundary, two final kinetical equations would be made as follows: α=6.69×10^(-2) At for 0<a<0.74 and ln(1-α)=-A(9.83×10^(-2)t+1.76) for 0.74<α<1, where α is SO_2 evolved in time t and A is surface area of Cu_2O grains.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
1991年第6期B376-B379,共4页
Acta Metallurgica Sinica
