摘要
本文利用扫描热显微镜 (SThM) ,以微米级的空间分辨率 ,测量了SiC Cu和SiC Al电封装复合材料增强相 基体的界面特征和界面导热性能。SThM热图显示出材料界面导热性能的差异 ,对形貌数据和热数据进行统计分析和转换 。
In this article, interface features and interface thermal conductivity of SiC/Cu and SiC/Al composites for electronic packaging were investigated at the micron scale by the scanning thermal microscope (SThM). The thermal images display the differences of the interface thermal conductivity of composites. The statistical analysis was used to process and translate topographic and thermal data in order to determine the interface width and interface thermal conductivity of composites.
出处
《电子显微学报》
CAS
CSCD
北大核心
2001年第3期238-243,共6页
Journal of Chinese Electron Microscopy Society
基金
国家自然科学基金
北京市自然科学基金资助项目
