摘要
根据微弧氧化过程中的一些现象 ,研究和分析了微弧氧化过程中电压和电流的变化规律以及微弧产生的机理。结果表明 ,微弧氧化过程中 ,电压是影响微弧氧化的主要因素之一 ,电压值不能过高 ,否则将造成陶瓷膜的破坏。电流值在微弧氧化过程中的各个阶段相异 ,微弧氧化过程具有明显的阶段性。它可以初步分为始氧化膜形成阶段。
Based on some phenomena in microarc oxidation process, the regularity of current and voltage variation and the mechanism of microarc occurrence were investigated. The results showed that the voltage is one of the key factors influencing microarc oxidation during microarc oxidation process, so the voltage couldn't be too high. Otherwise the ceramic film would be destroyed. The currents were different in the different stages of microarc oxidation. There are distinct periods in the process of microarc oxidation which could be preliminarily divided into three periods: primary ceramic film formation, microarc induction and oxidation balance.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2001年第3期4-5,共2页
Special Casting & Nonferrous Alloys
