期刊文献+

Integrated physics package of a chip-scale atomic clock 被引量:4

Integrated physics package of a chip-scale atomic clock
下载PDF
导出
摘要 The physics package of a chip-scale atomic clock (CSAC) has been successfully realized by integrating vertical cavity surface emitting laser (VCSEL), neutral density (ND) filter, λ/4 wave plate, 87Rb vapor cell, photodiode (PD), and magnetic coil into a cuboid metal package with a volume of about 2.8 cm3. In this physics package, the critical component, 87Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of 87Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7 × 10^-10τ-1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC. The physics package of a chip-scale atomic clock (CSAC) has been successfully realized by integrating vertical cavity surface emitting laser (VCSEL), neutral density (ND) filter, λ/4 wave plate, 87Rb vapor cell, photodiode (PD), and magnetic coil into a cuboid metal package with a volume of about 2.8 cm3. In this physics package, the critical component, 87Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of 87Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7 × 10^-10τ-1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第7期470-474,I0003,共6页 中国物理B(英文版)
基金 supported by the Knowledge Innovation Project of Chinese Academy of Sciences(Grant No.KGCX2-YW-143)
关键词 chip-scale atomic clock (CSAC) physics package 87Rb vapor cell coherent population trapping(CPT) chip-scale atomic clock (CSAC), physics package, 87Rb vapor cell, coherent population trapping(CPT)
  • 相关文献

参考文献14

  • 1Lutwak R, Emmons D, Riley W and Garvey R M 2002 34th An- nual Precise Time and Time Interval (PTTI) Meeting, Reston, Virginia, p. 539. 被引量:1
  • 2Liew L, Knappe S, Moreland J, Robinson H, Hollberg L and Kitching J 2004 Appl. Phys. Lett. 84 2694. 被引量:1
  • 3Knappe S, Shah V, Schwindt P D D, Hollberg L and Kitching J 2004 Appl. Phys. Lett. 85 1460. 被引量:1
  • 4Gerginov V, Knappe S, Schwindt P D D, Shah V, Liew L, Moreland J, Robinson H G, Hollberg L, Kitching J, Brannon A, Breitbarth J and Popovic Z 2005 2005. IEEE International Frequency Control Sympo- sium and Exhibition, Vancouver, Canada, p. 758. 被引量:1
  • 5Knappe S, Schwindt P D D, Shah V, Hollberg L, Kitching J, Liew L and Moreland J 2005 Opt. Express 13 1249. 被引量:1
  • 6Lutwak R, Deng J, Riley W, Varghese M, Leblanc J, Tepolt G, Mescher M, Serkland D K, Geib K M and Peake G M 2004 36th Annual Precise Time and Time Interval (PTTI) Meeting, Washington DC, USA, p. 339. 被引量:1
  • 7Mescher M, Lutwak R and Varghese M 2005 The Draper Technology Digest 10 26. 被引量:1
  • 8Lutwak R, Vlitas P, Varghese M, Mescher M, Serkland D K and Peake G M 2005 IEEE International Frequency Control Symposium and Ex- hibition, Vancouver, Canada, p. 752. 被引量:1
  • 9Knapkiewicz P, Dziuban J, Walczak R, Mauri L, Dziuban P and Gorecki C 2010 Procedia Engineering of Eurosensors Conference, Linz, Austria, p. 721. 被引量:1
  • 10Vecchio F, Venkatraman V, Shea H, Maeder T and Ryser P 2010 Pro- cedia Engineering of Eurosensors Conference, Linz, Austria, p. 367. 被引量:1

同被引文献21

  • 1伊林,陈徐宗.原子钟研究及其进展[J].科学,2005,57(5):8-10. 被引量:7
  • 2KITCHING J, KNAPPE S, LIEW L, et al. Chip-scale atomic frequency references: fabrication and performance [C] // Proceedings of the 19th European Frequency and Time Forum. Besancon, France, 2005: 575- 580. 被引量:1
  • 3KITCHING J, KNAPPE S, SCHWINDT P D D, et al. Power dissipation in a vertically integrated chip-scale atomic clock [C] //Proceedings of IEEE International Frequency Control Symposium and Exposition. Montreal, Canada, 2005: 781- 784. 被引量:1
  • 4KNAPPE S, SHAH V, SCHWINDT P D D, et al. A micro- fabricated atomic clock [J]. Applied Physics I.etters, 2004, 85 (9) : 1460- 1462. 被引量:1
  • 5MESCHER M J, LUTWAK R, VARGHESE M. An ultra- low-power physics package for a chip-scale atomic clock [C] //Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems. South Ko- rea, 21)1)5:311- 316. 被引量:1
  • 6LUTWAK R, VIATAS P, VARGHESE M, et al. The MAC--a miniature atomic clock [C] //Proceedings of IEEE International Frequency Control Symposium and Exposition. Vancouver, Canada, 201)5: 752- 757. 被引量:1
  • 7LUTWAK R, RASHED A, VARGHESE M, et al. The minia- ture atomic clock pre-production results [C] //Proceedings of Joint IEEE International Frequency Control Symposium/the 21t European Frequency and Time Forum. Geneva, Switzer- land, 2007: 1327-1333. 被引量:1
  • 8LUTWAK R. The chip-scale atomic clock--recent develop- ments [C] //Proceedings of Joint Meeting of the 23ra Euro- pean Frequency and Time Forum/IEEE International Frequen- cy Control Symposium. Besancon, France, 2009: 573- 577. 被引量:1
  • 9de NATALE J F, BORWlCK R L, TSAI C, et al. Compact, low-power chip-scale atomic clock [ C ] //Proceedings of IEEE/ON Position, Location and Navigation Symposium. Monterey, CA, 2008:355-358. 被引量:1
  • 10I.AWS A D, BORWICK R, STUPAR P, et al. Thermal and structural analysis of a suspended physics package for a chip- scale atomic clock [J]. Journal of Electronic Packaging, 21H19. 131 (4): 041005-1- [)41005-9. 被引量:1

引证文献4

二级引证文献11

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部