摘要
为提高聚酰亚胺（PI）的耐热性，将碳硼烷结构引入PI中，合成了一种新型的含2个碳硼烷、炔基和酰亚胺环的PI单体。采用红外光谱（FT—IR）法、核磁共振氢谱（1H—NMR）法对其结构进行了表征，并采用差示扫描量热（DSC）法和热失重分析（TGA）法对其热性能进行了探讨。研究结果表明：该单体在400～500℃范围内固化，500～1100℃时几乎无失重；该单体的合成路线为耐高温PI材料的研究领域提供了新的思路。
In order to improve the heat-resistance of polyimide （PI）, a novel PI monomer with two carboranes, alkynyl and imide ring was synthesized when carborane structure was introduced into PI. Its structure was characterized by infrared spectrum （FT-IR） and ＇H-nuclear magnetic resonance （＇H-NMR） , and its heat-resistance was discussed by differential scanning calorimetry（DSC） and thermogravimetie analysis （TGA）. The research results showed that the curing temperature range of monomer was 400-500 ℃, its lost weight was almost remained at 500- 1 100 ℃. The synthesis route of monomer could provide new thinking for research field of PI material with high temperature resistance.
出处
《中国胶粘剂》
CAS
北大核心
2014年第5期10-13,共4页
China Adhesives
关键词
碳硼烷
耐高温
聚酰亚胺
carborane
high temperature resistance
polyimide （PI）
