摘要
柔性、透明超高阻隔膜在高附加值领域上的需求越来越多,如有机薄膜太阳能电池、柔性有机发光二极管、电子纸和轻质真空绝热板。回顾了普通包装膜到超高阻隔封装膜的研究发展历程,着重从制备方法、膜层结构、水氧阻隔性能以及应用现状四个方面,系统阐述用于柔性电子元件封装的超高阻隔无机氧化物薄膜的制备工艺现状,并对其市场的发展前景进行了深入的调查研究。认为成本高是制约超高阻隔膜大规模产业化的主要因素,同时指出了未来的研究重点。
The latest development of flexible and transparent,ultra-high barrier films was reviewed in a thought provoking way. Its wide applications,such as the flexible electronic packaging materials,solar cell encapsulating materials,flexible organic light emitting diodes,electronic paper,light-weight vacuum insulation panels,etc,have been attracting an increased research interest. The discussions focused on： i） Its synthesis techniques,including polymer multilayer（ PML） process,plasma enhanced chemical vapor deposition（ PECVD）,atomic layer deposition（ ALD）, dual-target reactive magnetron sputtering,and lamination of composites; ii） Characterization of its microstructures, iii） Its water vapor and oxygen transmission rate（ WVTR and OTR）. In addition,its development trends,potential applications and market prospectswere also briefly discussed. We suggest that reduction of its high fabrication cost be a challenging project for researchers.
出处
《真空科学与技术学报》
EI
CAS
CSCD
北大核心
2014年第5期543-548,共6页
Chinese Journal of Vacuum Science and Technology
关键词
阻隔膜
氧化硅
真空制备工艺
市场
Barrier film
Silicon oxide
Vacuum preparation process
Market
