摘要
多点焊,局部焊又称选择性焊接,就是指对PCB上特定位置的电子元件进行"有选择性"焊接。选择性焊接不同于波峰焊接,选择性焊接的焊料是定位喷射的,而PCB板则在喷射的焊料上面移动。治具都是根据PCB板上元件的位置定制。目前,这种工艺已经越来越多地用于小批量有一定数量后装件的产品上。我公司产品由于存在这种生产特点,所以因生产需要,开发研制了一台局部喷流焊锡炉,经现场多年使用,焊接效果好,质量稳定,成为公司的重要设备之一。
Local spray soldering is known as multiple spot soldering, or selective soldering. It refers to selective soldering components of specified location on PCB. Nowadays, this technology is more and more applied to those small batch products which have a number of post plug-in components. In order to meet the need of production for such products in our company, this equipment is designed and developed independently. This paper introduces its design principle, system structure and control flow etc. Through its use on site for more than a year, it has achieved the good soldering effects and stable quality.
出处
《自动化博览》
2014年第5期110-112,114,共4页
Automation Panorama1
关键词
局部喷流焊接
选择性焊接
控制
Local spray soldering
Selective soldering
Control
