摘要
以次磷酸钠(NaH_2 PO_2·H_2O)为还原剂,硫酸铜(CuSO_4·5H_2O)为前驱体,十六烷基三甲基溴化铵(CTAB)为表面活性剂,聚乙烯吡咯烷酮(PVP)为保护剂,在一缩二乙二醇(DEG)有机液相溶液中采用化学还原法成功地制备了铜纳米颗粒.采用XRD、TEM、SEM、纳米粒度仪及IR对所制备的铜纳米颗粒的结构、形貌、粒径大小及表面物质进行表征.结果表明制备的纳米铜粒子为球型颗粒,分散较好,尺寸较为均匀,平均粒径约为27 nm,并且具有立方晶型结构,其表面被有机物包覆.涂布纳米铜导电墨水的样品,其在高于250℃的温度下烧结60min后得到导电铜薄膜.温度在300℃烧结后,导电铜薄膜更加致密,可以推测铜薄膜的导电性能会增加.
With NaH2PO2·H2O as reductant, CuSO4 · 5H2O as precursor, CTAB as surface-active agents and PVP as dispersing agent, copper nanoparticles have been successfully prepared by chemical reduction in organic system （DEG）. The resulting copper nanopartieles are characterized by XRD, SEM, TEM and IR. The results show the nanoparticle structure, morphology, distribution of particle size and surface content. A conductive copper film has been obtained by sintering （250 ℃, 60 min. ） a lmlyimide suhstrate coated with nanocopper conductive ink. When the sintering temperature is increased to 300 ℃, the copper thin film becomes more compact with enhanced conductivity.
出处
《复旦学报（自然科学版）》
CAS
CSCD
北大核心
2014年第2期187-191,共5页
Journal of Fudan University：Natural Science
基金
上海市教育委员会科研创新资助项目(12YZ005)
国家自然科学基金资助项目(21173144
21003088)
关键词
导电墨水
纳米铜
化学还原法
烧结
conductive ink
nanocopper
chemical reduction
sintering
