摘要
电力电子设备元器件的温度是影响电力电子设备性能和可靠性的关键因素之一。在IGBT功率模块散热方面,目前的研究热点之一是在模块的设计阶段应用直接冷却技术,将散热鳍片集成在功率模块的铜基板上。这种结构使IGBT模块在安装固定时不再需要通过导热界面材料来连接模块铜基板和支撑底板,因而使模块的总热阻大大降低。本文对自主研发的二合一直接冷却IGBT功率模块进行了仿真试验研究,并对比了传统间接冷却模块的散热性能,试验结果表明直接冷却模块的热阻最高降低了33%,而且温度场分布也更加均匀。仿真结果与试验结果一致,证明了仿真模型的准确性。
The temperature of the components of the power electronic equipment is one of the key factors for its per- formance and reliability. For the heat dissipation of the IGBT power module, one of the most popular research focus is using the direct cooling technology to integrate the radiating fins into the copper substrate of the power module in the design phase. This structure ensures the installation of the IGBT module doesn＇t need to use the thermal inter- face materials to connect the module copper substrate and the cooling plate any longer, thus makes the entire ther- mal resistance of the module to be reduced significantly. In this paper, we tested the heat dissipating performance of a self-developed 2 in 1 direct cooling IGBT module and contrasted with the traditional indirect cooling module. The experiment results show that entire thermal resistance of the direct cooling module is reduced up to 33% , meanwhile the temperature field distribution is more uniform. In this paper, we also established a simulation model for the direct cooling power module, which has a satisfied consistency with the test results, therefore we can use the model to research the heat dissipating performance of the direct cooling module deeply.
出处
《电工电能新技术》
CSCD
北大核心
2014年第4期21-25,60,共6页
Advanced Technology of Electrical Engineering and Energy
基金
国家高技术研究发展计划(863计划)资助项目(2011AA11A258)
关键词
功率模块
直接冷却
温度场
热阻
power module
direct cooling
temperature field
thermal resistance
