摘要
概述了高频基材的发展现状,重点探讨了其选型原则,并介绍了高频印制板对基材的介电常数(Dk)、介质损耗因数(Df)、铜箔表面粗糙度等方面提出的特殊要求,最后分析了全球主要高频基材供应商的相关产品材料组成及其介电性能。
The development situation of substrate materials for high frequency printed circuit board （PCB） was summarized, and the selection principle of substrate materials was mainly discussed. The special re-quirements of high frequency PCB on the dielectric loss（Dk）, dielectric dissipation factor（Df） and surface roughness of copper foil of the substrate materials were introduced, and the material composition and di-electric properties of relative products from global main high frequency substrate materials supplier were analyzed.
出处
《绝缘材料》
CAS
北大核心
2014年第1期17-21,共5页
Insulating Materials
基金
国家科技重大专项(2011ZX02709-002)
