摘要
微米尺寸Ag2O焊膏相对于纳米银焊膏成本低廉且在高温电子互连封装行业中有应用前景.为了进一步降低连接成本及提高接头的抗电化学迁移能力,向Ag2O焊膏中加入镀银铜粉制得了新型混合焊膏.文中对比了用原有微米尺寸Ag2O焊膏与加入镀银铜粉后的新型混合焊膏连接所得接头的抗剪强度以及两种焊膏烧结后的抗电化学迁移能力.结果表明,在连接温度为250℃时,用含镀银铜粉的混合Ag2O焊膏连接的接头抗剪强度下降明显,但焊膏烧结后的抗电化学迁移能力获得显著提升,水滴试验结果表明其电迁移短路时间延长了一倍以上.
The micro-scaled Ag2O paste is cheaper than Ag nanoparticle paste and has a promising application prospect in high temperature electronic packaging industry.In order to further reduce the cost and improve the joint ability of the resistance to electrochemical migration(ECM),the Ag-coated Cu particles were added into the original micro-scaled Ag2O paste to make a new composite paste.In this paper,the shear strength of joints obtained by using the original Ag2O paste and the new Ag2O paste contained Ag-coated Cu particles and the two sintered pastes' ability of resistance to ECM were compared.The results revealed that the average shear strength of joints obtained by using the new Ag2O paste with Ag-coated copper at the typical bonding condition(250 ℃,5 min,2 MPa) showed an obvious decrease,while the ability of the resistance to ECM got a significant increase due to the addition of Ag-coated Cu particles.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2014年第2期15-18,113,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金项目(51375261
51075232)
北京市自然科学基金项目(3132020)
先进焊接与连接国家重点实验室开放课题研究基金重点项目(AWPT-Z12-04)
清华大学自主科研计划项目(2010THZ 02-1)
关键词
镀银铜粉
氧化银焊膏
电化学迁移
电子封装
Ag-coated Cu particles
Ag2O paste
Electrochemical migration(ECM)
Electronic packaging
