摘要
过去，在制备质轻、导电性能良好填料并用于减小静电积累、对电子设备影响方面的报道较少。对平均粒径为100μm的云母粉体采用碱性体系进行化学镀镍。从镍沉积量方面分析了镀液组分、温度、时间等对镀镍的影响；用JSM-5610LV扫描电子电镜观察了镀镍层的形貌；用RTS-5四探针电阻仪测试了云母镀镍填料涂料涂层的导电性能。结果表明：最佳碱性化学镀镍工艺为40g／L硫酸镍，40g／L次磷酸钠，65∥L柠檬酸钠，温度约70℃，时间1．0～1．5h，pH值为9～10；获得的镀镍层连续、均匀、致密；含50％镍云母填料涂料涂层的电阻率可达50-60Ω·cm。
Electroless nickel plating of mica powder was conducted in an alkaline bath,and the effects of bath composition and temperature,as well as time on electroless nickel plating were investigated. The morphology of as-plated Ni coating was observed with a scanning electron microscope,and the electric conduction performance of Ni-coated mica powder was evaluated with a four-probe resistance meter. Results indicated that,in terms of alkaline bath electroless Ni plating of mica powder with a diameter of 100 μm,the optimized plating bath consisted of 40 g / L NiSO4,40 g/L NaH2PO2,and 65 g/L C6H5Na3O7( sodium citrate); and the optimized electroless Ni plating parameters were suggested as temperature of 70 ℃,time of 1. 0 ~ 1. 5 h,and bath pH value of 9 ~ 10. Ni coating obtained under the optimized parameters was continuous and uniform; and in particular,Ni-coated mica powder containing 50% Ni( mass fraction) had an electrical resistivity of 50 ~ 60 Ω·cm.
出处
《材料保护》
CAS
CSCD
北大核心
2014年第1期34-36,9,共3页
Materials Protection
关键词
化学镀镍
云母粉
导电填料
电阻率
electroless nickel plating
mica powder
conductive filler
process optimization
