摘要
为了实现双工器小型化设计,基于一种多边形结构的SIR谐振结构,采用三维电磁仿真软件HFSS,仿真设计了一种微带双工器,所用的是0.508mm厚的Rogers4003基板,其介电常数为3.55,得到工作频段为3.7～4.2GHz和5.925～6.425GHz的双工器.由仿真结果可知,通带内插损小于1.4dB,通带间带外抑制大于49dB@中心频率,通带隔离度大于50dB.
In order to realize the miniaturization of diplexer, a microstrip diplexer was designed by three-dimensional electromagnetic simulation software HFSS. It was manufactured on the Rogers4003 substrate of 0, 508ram with a dielectric constant of 3. 55. Its bands are 3. 7~4. 2GHz and 5. 925~6. 425GHz. HFSS simulation shows that the insert loss is less than 1.4dB. The suppression is better than 49 dB at the center frequency of the other filer. Channel isolation is better 50dB.
出处
《舰船电子工程》
2013年第11期134-136,共3页
Ship Electronic Engineering
