摘要
塑封集成电路在高可靠性领域应用越来越广泛,国内已有相当数量的塑封集成电路应用于国防领域。但是,目前大部分关键塑封集成电路依赖进口,采购渠道不是很通畅,市场中存在大量的翻新件。文章基于塑封集成电路封装工艺,简要介绍如何识别翻新塑封集成电路。
Plastic packaging ICs have been used more widely in the high reliability application, and there are a number of plastic packaging ICs are applied to national defense fields. But the stock channel is not so fluency, and most of the chief plastic packaging ICs are imported from abroad, so there exist a mass of remark ICs. Based on packaging technology, the author will introduce how to detect the remark ICs.
出处
《电子与封装》
2013年第10期5-9,共5页
Electronics & Packaging
关键词
高可靠性
翻新
塑封集成电路
high-reliability
remark
plastic packaging ICs
