摘要
文中提出一种TDR时域测量和MMTL建模仿真相结合的建模方法,能精确地对芯片内部以及外部接口传输线建模。克服了芯片内部无法探测的问题,具有直观便于优化的特点,实验结果表明,这种建模方法可以通过不断修正和拟合的方法达到测量和仿真较高的吻合度。
In this paper, a new chip package rriodeling method which combines time domain TDR measurement and multi-segment multiple transmission line model simulation was proposed. The method overcomes the chip internally probing problem, with characteristics of intuitive and easy to optimization. The experimental results show that the modeling method achieves accurate fitting through continuous modification and fitting method by iterating between measurement and simulation.
出处
《信息技术》
2013年第10期139-140,144,共3页
Information Technology
关键词
TDR
时域测量
芯片建模
MMTL
Key time domain reflector （TDR）
time domain measurement
chip package modeling
multi-segment multiple transmission line
