摘要
利用自行研制的高速喷射电沉积装置电沉积镍。研究了电流密度与沉积速率的关系 ,并将所得沉积层与槽镀沉积层进行比较。结果表明 :采用此装置 ,允许使用的极限电流密度及沉积速率均增大 ,所得沉积层硬度值 (Hv)比一般槽镀层高出 2 0 0左右 ,镀层生长形态由枝晶生长转变为柱状生长。
Self-developed equipment for high speed nickel jet-electrodeposit was adopted to obtain nickel layer. The relationship of current density with deposit speed was studied. Properties of jet-electrodeposited nickel layer was compared with that of conventional electroplated layer, and the results showed that the limit current density and the deposit speed as high speed nickel jet-electrodeposit increased, and vickers hardness of obtained deposit was about 200 higher than that of conventional plated layer. The crystal configuration of jet-elcetrodeposited coatings converts from dendritic growth to columnar growth.
出处
《电镀与涂饰》
CAS
CSCD
2000年第5期1-3,共3页
Electroplating & Finishing
基金
河北省自然科学基金!资助项目 (5 982 5 0 )
