摘要
为了对微纳加工工件进行三维形貌测量,建立了基于小孔阵列的并行激光共聚焦显微检测系统。利用自行研发的三波长皮秒脉冲激光加工机在面积为1cm2的铜箔上制备100×100的小孔阵列,以实现并行分光,小孔的平均直径为43.6μm,间距为100μm。利用小孔阵列系统,分别对镀膜平板和螺钉进行了三维测量。实验结果表明,在轴向平移台步距为1μm的条件下,本文系统能对待测样品实现轴向分辨率为1μm、横向分辨率为20μm的三维扫描并重构出样品形貌。本文共焦显微检测方法能大大提高共焦扫描速度,能很好满足一般工业检测需求,本文为并行共焦探测技术提供了一条新的研究和运用方法。
In order to measure workpiece＇s micro-nano three-dimensional topography,this paper sets up a parallel confocal microscopy detection system based on the pinhole array. Firstly, in order tO realize the beam splitting in parallel,a pinhole array of 100 × 100 in the copper foil is made by the laboratory＇s three-wavelength picosecond pulse laser processing machine, and the pinhole array＇s area is a square cen- timeter,the average diameter of the pinhole is 43.6 μm,and the spacing between holes is 100μm. Then the Fraunhofer diffraction model of the pinhole array is studied. Secondly, the three-dimensional image reconstruction algorithm and laser speckle homogenization are analyzed. Finally, the measuring system makes three-dimensional measurement for coating plate and screw respectively. The experimental results show that the axial resolution of 1 μm and the lateral resolution of 20μm are attained and the three di- mensional reconstruction image is obtained under the condition that the stepping motor moves 1μm per step. This parallel confocal microscopy system greatly improves the three-dimensional testing speed and can satisfactorily meet the general industrial testing requirement. This paper provides a new method of research and application for parallel confocal detection technology.
出处
《光电子．激光》
EI
CAS
CSCD
北大核心
2013年第10期1989-1994,共6页
Journal of Optoelectronics·Laser
