4Freeston IL.From Four Point to Impedance Imaging[J].Engineering Science and Education Journal,1997,6 (6):245-254. 被引量：1
5Tay C J.Surface Roughness Measurement of Semi-conductor Wafers Using a Modified Total Integrated Scattering Model[J].Int.J.Light and Electron Optiea,2002,113(7):317-321. 被引量：1
6Kaminski A,Marehand J J,Laugier A.I-V Method to Extract Junction Parameters with Special Emphasis on Low Series Resistance[J].Solid-State Electron,1999,43:741-74533. 被引量：1
7Miles R W,Hynes K M,Forbea I.Photovoltaic Solar Cells:an Overview of State-of-the-SArt Cell Development and Environmental Issues[J].Progress in Crystal Growth and Characterization of Materials,2005,51 (1-3):1-42. 被引量：1
8Watanabe M,Tabuse D.Surface Contamination of Bonding Pads Incapable of Au Wire Bonding[C]//IEEE/CPMT Int.Electron Manufact Teehmol Syrup,1998,187-193.228-229. 被引量：1
