期刊文献+

九层玻璃/铝阳极焊接接头残余应力应变数值模拟

Numerical Simulation of Residual Stress and Strain of Bonded Nine-layer Glass & Aluminium
下载PDF
导出
摘要 利用有限元分析软件MARC,对冷却后的九层玻璃/铝阳极焊接试件进行数值模拟分析,获得了九层阳极冷却试件内残余应力和应变分布。模拟结果表明,试件冷却后各处的冷却收缩量不同,其内部存在残余应力和应变,试件发生翘曲;过渡层内的等效应力最大,且关于铝层呈对称分布;铝层内的等效应力值达到了屈服极限,表明铝层发生了塑性变形,且铝层内的等效应变最大。 After cooling, the bonded nine-layer glass & aluminum was analyzed by finite element analysis software MARC. The residual stress and strain distributions in the bonded nine-layer glass & aluminum during cooling process were obtained. The simulation results indicate that there are residual stress and strain in the bonding due to un-uniform shrinkages, which can cause the distortion of the bonding. The maximum value of the equivalent stress is in transition layers, which is symmetric about the aluminum layer. The plastic deformation occurs in the aluminum layer because the equivalent stress in the aluminum layer reaches the yield stress of aluminum, and the maximum value of equivalent strain is in aluminum layers.
出处 《机械工程与自动化》 2013年第5期92-94,共3页 Mechanical Engineering & Automation
基金 国家自然科学基金资助项目(51275332) 山西省科技攻关项目(20100321084)
关键词 阳极焊接 九层玻璃 铝试件 MARC 残余应力应变 anodic bonding~ bonded nine-layer glasses/aluminum MARC residual stress and strain
  • 相关文献

参考文献6

二级参考文献25

  • 1胡利方,秦会峰,宋永刚,孟庆森.固体电解质(玻璃)与硅的阳极连接机理及界面分析[J].材料导报,2006,20(F05):356-358. 被引量:1
  • 2秦会峰,孟庆森,宋永刚,胡利方,张惠轩.硼硅玻璃与硅阳极键合界面形成机理分析[J].功能材料,2006,37(9):1369-1371. 被引量:6
  • 3孟庆森 薛锦.β″-Al2O3陶瓷与铝基复合材料场致扩散连接界面微观结构分析.硅酸盐学报,2002,30(4):447-450. 被引量:2
  • 4Tai-Ran Hsu.微机电系统封装[M].北京:清华大学出版社,2006. 被引量:2
  • 5Li Zhihong, Hao Yilong. An SOI-MEMS technology using substrate layer and bonded glass as wafer-level package [J]. Sensors and Actuators, 2002, 96: 34-42. 被引量:1
  • 6Avallon E A,Baumeister T. Mark's Standard Handbook for Mechanical Engineers[C]. New York: 13th edn. McGraw- Hill, 1996. 被引量:1
  • 7Hsu Tai-Ran. MEMS & Microsystems Design and Manufacture [M]. McGraw-Hill Education (Asia) Companies, 2002. 被引量:1
  • 8G Wallis, D I Pomerantz. Field assised glass-metal sealing[J]. J Appl Phys, 1969,40 : 3946-3949. 被引量:1
  • 9R H Doremus. Glass science[M]. 2nd edn. Chichester: John Wiley & Sons, 1994. 被引量:1
  • 10K M Knowles,A T J Van Helvoort. Anodic bonding[J]. International Materials Reviews92006951 : 273-311. 被引量:1

共引文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部