摘要
综合评述国内无铅焊点可靠性有限元模拟的研究进展。随着电子器件微型化和高可靠性的转变,焊点的尺寸也越来越小,焊点可靠性数值模拟研究成为电子工业中的重要研究课题。对比国外的科研成果,中国的研究者在焊点可靠性数值模拟领域成果具有明显的国际先进性,但是在焊点可靠性数值模拟中的理论成果相对薄弱,在理论层面上具有较大的上升空间。
This paper introduced the status of lead-free solders reliability based on finite element simulation. With the miniaturation and high-reliability transformation of electronic devices,the sizes of lead-free solder joints become smaller,and its reliability investigation turns into the important research subject. Comparing with abroad achievements in this field ,it is found that the productions of Chinese researcher have obvious advance, however, the theories findings are weak, and it is need great efforts to improve it.
出处
《电焊机》
北大核心
2013年第7期88-91,共4页
Electric Welding Machine
基金
江苏省自然科学基金资助项目(BK201244)
江苏省高校自然科学基金(12KJB460005)
江苏科技大学先进焊接技术省级重点实验开放研究基金(JSAWS-11-03)
江苏师范大学自然科学基金资助项目(11XLR16)
关键词
SCI
EI
无铅焊点
可靠性
有限元模拟
SCI/EI
lead-free solder joints
reliability
finite element simulation
