摘要
集成电路封装工艺中,芯片表面的氧化物等污染物会降低产品质量。在封装工艺过程中,引线键合工艺之前对引线框架进行等离子清洗,可以有效清除这些杂质,提高产品成品率和质量。针对此,主要介绍了在线等离子清洗设备的工艺,结构和市场前景。
In IC assembly and packaging process, the chip surface oxides and other contaminants will reduce the product quality. The cleaning for the lead frame before wire bonding plasma can effectively remove these impurities. This article mainly introduces the technology of on-line plasma treatment equipment, structure, and market prospects.
出处
《山西电子技术》
2013年第3期39-40,共2页
Shanxi Electronic Technology
关键词
等离子清洗
引线框架
集成电路封装
plasmacleaning
lead frame
integrated circuit packaging
