摘要
采用定点激光反射热循环方法 ,测量了硅基体上铜膜应力随温度的变化及等温松弛 .结果表明 ,开始加热时 ,应力随温度的增加以 - 2 6 2MPa ℃的速率线性减小 ,与弹性理论一致 ,压屈服强度与膜厚的倒数成正比 .在各种给定温度下 ,应力随时间均按负指数形式松弛 。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method. At low temperatures the stress decreases linearly as a function of temperature at a rate of -2.62 MPa/℃, in good agreement with the elasticity theory. The compressive yield strength of pure copper film is reciprocal to the film thickness. Stress relaxations are observed at various given temperatures. The variation of stress with time is exponential form and the relaxation time constant is strongly dependent on temperature.
出处
《陕西师范大学学报（自然科学版）》
CAS
CSCD
北大核心
2000年第1期44-48,共5页
Journal of Shaanxi Normal University：Natural Science Edition
基金
国家自然科学基金资助项目!(59571031)
关键词
定点激光反射
铜膜
屈服强度
应力松驰
硅基
fixed-point laser reflection method
copper films
yield strength
stress relaxation
