期刊文献+

Equivalent oxide thickness scaling of Al_2O_3/Ge metal-oxide-semiconductor capacitors with ozone post oxidation 被引量:1

Equivalent oxide thickness scaling of Al_2O_3/Ge metal-oxide-semiconductor capacitors with ozone post oxidation
下载PDF
导出
摘要 Aluminum-oxide films deposited as gate dielectrics on germanium (Ge) by atomic layer deposition were post oxidized in an ozone atmosphere. No additional interfacial layer was electron microscopy and X-ray photoelectron spectroscopy detected by the high-resolution cross-sectional transmission measurements made after the ozone post oxidation (OPO) treatment. Decreases in the equivalent oxide thickness of the OPO-treated Al2O3/Ge MOS capacitors were confirmed. Furthermore, a continuous decrease in the gate leakage current was achieved with increasing OPO treatment time. The results can be attributed to the film quality having been improved by the OPO treatment. Aluminum-oxide films deposited as gate dielectrics on germanium (Ge) by atomic layer deposition were post oxidized in an ozone atmosphere. No additional interfacial layer was electron microscopy and X-ray photoelectron spectroscopy detected by the high-resolution cross-sectional transmission measurements made after the ozone post oxidation (OPO) treatment. Decreases in the equivalent oxide thickness of the OPO-treated Al2O3/Ge MOS capacitors were confirmed. Furthermore, a continuous decrease in the gate leakage current was achieved with increasing OPO treatment time. The results can be attributed to the film quality having been improved by the OPO treatment.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第6期561-564,共4页 中国物理B(英文版)
基金 supported by the National Program for Key Basic Research Projects (973 Program) of China (Grant No. 2011CBA00607) the National Natural Science Foundation of China (Grant Nos. 61106089 and 51102048) the National Science and Technology Major Projects (Grant No. 2009ZX02035) the State Key Laboratory of ASIC and System Project (Grant No. 11MS017) the Open Funds of State Key Laboratory of ASIC and System at Fudan University (Grant No. 10KF001)
关键词 Al2O3 gate dielectric ozone post oxidation equivalent oxide thickness electrical properties Al2O3 gate dielectric, ozone post oxidation, equivalent oxide thickness, electrical properties
  • 相关文献

参考文献19

  • 1Saraswat K, Chui C O, Donghyun K, Krishnamohan T and Pethe A 2006 Tech. Dig. - Int. Electron Devices Meet. 659. 被引量:1
  • 2Takagi S, Mizuno T, Tezuka T, Sugiyama N, Numata T, Usuda K, Moriyarna Y, Nakaharai S, Koga J, Tanabe A, Hirashita N and Maeda T 2003 Tech. Dig. - Int. Electron Devices Meet. 57. 被引量:1
  • 3Shang H, Frank M M, Gusev E P, Chu J O, Bedell S W, Guarini K W and Ieong M 2006 IBM J. Res. Dev. 50 377. 被引量:1
  • 4Saraswat K C, Chui C O, Krishnamohan T, Nayfeh A and Mclntyre P 2005 Microelectron. Eng. 80 15. 被引量:1
  • 5Spiga S, Wiemer C, TaUarida G, Scarel G, Ferrari S, Seguini G and Fanciulli M 2005 Appl. Phys. Lett. 87 112904. 被引量:1
  • 6Delabie A, Bellenger F, Houssa M, Conard T, Elshocht S V. Cayrnax M, Heyns M and Meuris M 2007 Appl. Phys. Lett. 91 082904. 被引量:1
  • 7Li X F, Liu X J, Zhang W Q, Fu Y Y, Li A D, Li H and Wu D 2011 Appl. Phys. Lett. 98 162903. 被引量:1
  • 8Matsubara H, Sasada T, Takenaka M and Takagi S 2008 Appl. Phys. Lett. 93 032104. 被引量:1
  • 9Watanabe H, Okamoto G, Kutsuki K, Harriesl J, Yoshigoe A, Teraoka Y, Hosoi T and Shimura T 2010 Proceeding of International Sympo- sium on Technology Evolution for Silicon Nano-Electronics, June 3-5, 2010, Tokyo, Japan, p. 11. 被引量:1
  • 10Tabata T, Lee C H, Kita K and Toriumi A 2008 ECS Trans. 16 479. 被引量:1

同被引文献1

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部