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移动互联网络时代MEMS技术的创新发展 被引量:6

MEMS Technology Innovation and Development in the Mobile Internet Era
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摘要 微电子机械系统(MEMS)技术是半导体微电子学的创新,利用Si基集成电路的平面工艺从两维加工向三维加工发展,开创了MEMS新的领域。综述并分析了与信息产业以及移动网络相关的MEMS主流产品(加速度计、陀螺仪、微麦克风、数字微镜器件(DMD)、喷墨头和RF MEMS)的技术发展现状和趋势,同时预测了MEMS新兴产品(光滤波器、微小电子鼻、微扬声器、微超声器、微能量采集器和纳机电系统(NEMS))的科研现状和面临的技术挑战。从当前世界MEMS技术发展的特点(系统集成、与CMOS工艺结合走向标准加工、纳米制造与微米、纳米融合和多应用领域扩展)出发,结合国内MEMS技术发展的现状,提出我国MEMS技术发展的建议。 Micro-electromechanical system (MEMS) technology is the innovation of semiconduc- tor microelectronics. Through the development of the plane process from two dimensional pro- cessing to three dimensional processing in Si-based integrated circuit, the MEMS new fields are explored. The technology development status and trend of the MEMS mainstream products related to the information industry and mobile network, such as the accelerometer, gyroscope, micro microphone, digital micromirror device (DMD), ink jet head and RF MEMS, are sum- marized and analyzed. At the same time, the research situation and technical challenges of the MEMS emerging products, i.e. the optical filter, tiny electronic nose, micro speaker, micro ul- trasonic device, micro energy harvester and nano-electromechanical system (NEMS) are forecas- ted. Besides that, combined with the situation for the development of domestic MEMS techno- logy, the suggestions on the development of the MEMS technology are put forward, considering the development characteristics of current international MEMS technology which include the system inte- gration, development toward standard machining combined with the CMOS process, nano manufacturing and micro-nano fusion, and application extension.
作者 赵正平
出处 《微纳电子技术》 CAS 北大核心 2013年第6期337-341,共5页 Micronanoelectronic Technology
关键词 微机电系统(MEMS) 纳机电系统(NEMS) 加速度计 陀螺仪 微麦克风 数字微镜器件(DMD) 微能量采集器 喷墨头 micro-electromechanical system(MEMS) nano-electromechanical system(NEMS) acce-lerometer gyroscope micro microphone digital micromirror device(DMD) micro energy collector ink jet head
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同被引文献39

  • 1刘若冰,曹赞,张大成,彭春荣.MEMS领域新国际提案综述[J].标准科学,2022(S01):229-232. 被引量:2
  • 2张乐平,陈晓萍.MEMS产业化面临的机遇与挑战[J].中国集成电路,2007,16(8):34-36. 被引量:2
  • 3Yole Developmen. Status of the MEMS Industry 2012[J]. Research and Markets, 2012(7): 1-4. 被引量:1
  • 4Yole Developpement. Top 30 MEMS companies of 2012 [J]. Solid State Technology, 2012, 56(4): 35-36. 被引量:1
  • 5Yole Developpement. MEMS Front-End Manufacturing Trends [J]. Research and Markets, 2013(3): 96-114. 被引量:1
  • 6Peter Clarke. MEMS market to show 13% CAGR to 2017 [EB/OL]. http://www.eefimes, com/document.asp?doc_id =1262056 2012-04-07. 被引量:1
  • 7Peter Clarke. ST closes in on TI atop MEMS top 30 ranking [EB/OL]. http ://www.eetimes.corrg document.asp ? doc_id =1261430 2012-03-26. 被引量:1
  • 8Yole.2012年前20大MEMS晶圆代工厂排名[EB/OL].http//:.eeworld.tom.cn/xfdz/2013/0506/article一21744.html2013-05-06. 被引量:1
  • 9方震华,黄慧锋.微电子机械系统(MEMS)技术在军用设备中的应用现状[J].2010,26(4):1-4. 被引量:1
  • 10意法半导体MEMS芯片出货量突破30亿大关[EB/OL].http://www.eepw.com.cn/article/141731.htm2013-02-05. 被引量:1

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