摘要
研究了正、叔十二烷基硫醇在铜表面上的自组装及混合自组装成膜情况,并利用交流阻抗和极化曲线电化学方法测试了正、叔十二烷基硫醇在铜表面上自组装膜及混合自组装膜对铜的耐腐蚀性,考察了正十二烷基硫醇自组装膜质量与正十二烷基硫醇溶液的浓度及组装时间的关系。研究结果显示,混合自组装膜的质量及其对铜的耐腐蚀性比仅组装正或叔十二烷基硫醇均有很大的提高。
The self-assembled and film-forming processes of n-dodecyl mercaptan solution,t-dodecyl mercaptan solution and mixed solution of n-and t-dodecyl mercaptans on copper surface were investigated.The corrosion resistances of the self-assembled films formed in three kinds of solutions on copper surface using electrochemical techniques such as AC impedance and polarization curves,were tested.The connection between the quality of the self-assembled film of n-dodecyl mercaptan solution and concentration of the solution,and the assembly time were discussed.The results indicated that the self-assembled film formed in the mixed solution of n-and t-dodecyl mercaptans on copper surfaceshowed a much better advantage in both quality and corrosion resistance than that formed in only n-or t-dodecyl mercaptan solution.
出处
《分析测试学报》
CAS
CSCD
北大核心
2013年第5期614-618,共5页
Journal of Instrumental Analysis
关键词
正、叔十二烷基硫醇
铜表面
自组装膜
n-and t-dodecyl mercaptan
copper surface
self-assembled films
