摘要
介绍了一种红外焦平面阵列( IRFPA)互补金属氧化物半导体 ( CMOS)读出集成电路 ( ROIC)的研制方案 ,叙述了读出电路的电路原理及工作时序、电路参数设计、版图设计及工艺分析。电路采用电容负反馈互导放大器 ( CTIA)及相关双取样 ( CDS)结构 ,有利于减小电路的噪声。
A development of infrared focal plane array (IRFPA) complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC) is introduced. The circuit principle of ROIC, time sequence of multiplexer, circuit parameter, layout design and technology analysis are described. The adoption of capacitor feedback transimpedance amplifier(CTIA) and correlated double sampling (CDS) structure helps to reduce the noise of the circuit.
出处
《电子工程师》
2000年第9期39-41,共3页
Electronic Engineer
