摘要
近年来随着UV-LED的问世,为印制电路板曝光领域带来革命性的变化。其高效节能、恒定的光照强度、优秀的温度控制、几乎为零的维护成本。促使UV-LED面光源替代传统曝光灯成为发展趋势。文章针对印制电路板阻焊曝光工艺紫外光源的特点,论述了推广应用中需要克服的相关技术及解决方法;并通过实验数据,分析出影响UV-LED面光源曝光均匀性、时间、解析度的因素。实践表明,采用扫描式、混合波长的UV-LED面光源曝光方式,高效节能、光强分布均匀稳定、能够完全满足阻焊曝光过程对光源的指标要求,可操作性强,对印制电路板曝光工艺的品质提升与节能降耗将起到推动作用。
In recent years, the development of the UV-LED, bring revolutionary changes in the field of PCB exposure. It is energy efficient and has constant light intensity, good temperature control, and almost zero maintenance cost. It promotes UV-LED surface light source replacing the traditional exposure lamp and becomes a trend.ln accordance with the characteristics of the ultraviolet light source for PCB solder mask exposure process, this paper discusses not only the related technologies to overcorne the difficulties in the promotion and application, but also provided solutions through experimental data, analysis of the factors of impact on the uniformity, the time and the resolution of UV-LED surface light source exposure. Using scanning mixed-wavelength UV-LED surface light source exposure mode, the practice shows that it is energy efficient, and the light intensity distribution is uniform and stable, is able to fully meet the requirements of the indicators of the anti-welds exposure process, and the maneuverability is strong, and it will play a catalytic role in the PCB exposure process for quality improvement and energy conservation.
出处
《印制电路信息》
2013年第4期115-120,共6页
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