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全自动荧光粉涂覆工艺研究 被引量:1

Research on Automatic Phosphor Coating Process
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摘要 自行设计并搭建了一套全自动荧光粉涂覆系统。针对涂覆工艺,通过扫描电子显微镜研究真空搅拌除泡处理时间对涂覆质量的影响,结果发现未经真空搅拌除泡处理的荧光粉涂覆层中有直径达140μm的气泡,且涂覆层厚度均匀性较差;经过20和40 s真空搅拌除泡处理后涂覆层中气泡直径和数量都明显减少,涂覆层厚度均匀性也变好;经过60 s真空搅拌除泡处理后涂覆层中无明显气泡,涂覆层厚度均匀性进一步提高至1μm。分别不通过真空搅拌除泡处理和通过60 s真空搅拌除泡处理实现LED器件涂覆,通过LED器件光学参数综合测试仪测试上述两类器件的发光特性,结果发现60 s真空搅拌除泡处理能明显降低LED器件色坐标的离散性。 An automatic phosphor coating system was designed and set up. According to the coating process, the influence of the bubble-removing time on the phosphor coating quality by using the scanning electron microscopy was investigated. Results show that there are some bubbles with diameters about 140 μm among the phosphor coating without bubble-removing process, and the thickness uniformity of the coating is very bad. Both the diameter and number of bubbles reduce obviously by bubble-removing for 20 and 40 s, and the thickness uniformity of phosphor coating also gets better, while the bubble- removing time extends to 60 s. The obvious bubbles can not be found among phosphor coating and the thickness uniformity can be reduced to 1 μm. LED devices are coated without bubble-removing and with 60 s bubble-removing,.respectively. Luminescent properties of these above two kinds of LEDs are tested by using integrated luminescent properties tester. The discreteness of chromaticity coordinate for LED devices can be reduced obviously by 60 s bubble-removing.
出处 《半导体技术》 CAS CSCD 北大核心 2013年第4期288-291,共4页 Semiconductor Technology
基金 国家重点基础研究发展计划(973计划)资助项目 广东省科学技术厅项目(00946220118632064)
关键词 LED 荧光粉涂覆 真空搅拌除泡 涂覆层厚度均匀性 LED发光特性 LED phosphor coating bubble-removing thickness uniformity of the phosphor coating LED device luminescent properties
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参考文献9

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