摘要
采用DSC研究了不同升温速率下FM73M胶膜的固化反应特性,根据DSC曲线得到了胶膜的凝胶化温度和固化温度等工艺参数,建立了其固化动力学模型,确定胶膜的固化参数为(125±2)℃/90min。在此基础上,通过SEM研究了胶膜在PMI泡沫芯材内的分布以及界面结合状况(界面润湿情况、气孔、缺陷),分析了胶膜与泡沫芯的胶接机理。
The curing characteristics of FM73 M adhesive film was monitored by DSC and investigated under dif-ferent heating rates. According to the DSC graph, the theoretical parameters such as gelation temperature, peak tem-perature and the kinetic model of FM73 M adhesive film were acquired. And then 125± 2℃/90min is confirmed as the actual curing of the film. The distribution of FM73M adhesive film in the PMI foam core and the interface between the foam core and the film （interface wetting situation, porosity, defects） were observed by SEM. The adhesive mecha-nism of PMI foam and FM73M adhesive film was analyzed.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2013年第1期82-85,共4页
Aerospace Materials & Technology
关键词
胶膜
DSC
固化动力学
胶接机理
Adhesive film, DSC, Curing kinetics, Adhesive theory
