摘要
采用EBSD技术研究Cu含量对低碳低硅无取向电工钢热轧板、常化板、冷轧板和成品板表层织构的影响。结果表明,卷取过程中Cu元素在热轧板表层的偏聚作用阻碍{100}晶粒的长大,导致{100}织构组分减少,不利的{111}<100>、{112}<100>、{554}<100>织构和随机织构组分相对增加。常化过程中,表层偏聚的Cu元素在高温下向热轧板心部扩散,对晶粒长大抑制作用降低,同时{100}面具有低表面能,最终使得有利的{100}织构组分长大速率较快,织构组分含量增加。Cu元素对冷轧和成品板表层织构也有一定影响,加入Cu元素后,冷轧板表层{111}<112>织构得到加强,而{111}<110>织构被削弱,成品板的有利织构{100}<100>和{110}<100>面织构组分增加,不利织构{111}<100>组分减少,达到了改善织构,提高磁性能的目的。
Effect of Cu content on hot rolled, normalized, cold rolled and annealed strips of low-carbon and low-silicon non-oriented electrical steel was investigated by EBSD. The results show that during coiling process, surface segregation of Cu on hot rolled plate surface relatively hinders ｜ 100 t grain growth and reduces ｜ 100 ｜ textures, unfavorable texture of ｜ 111｜ 〈 100 〉, ｜ 1121 〈 100 〉, ｜ 554 f 〈 100 〉 and random texture are significantly increase. During normalizing process, the content of favorable texture of ｜ 100｜ increases and the growth rate is speeded up due to surface segregated Cu diffused to the core of hot plate at the high temperature and the low surface energy of 11001 ~ Cu element is also effect on cold rolled and annealed plate surface texture. With Cu adding, ｜ 111 t 〈 112 〉 texture significantly increases and ｜ 111 ｜ 〈 110 〉 texture significantly decreases in the cold rolled plate surface, favorable texture of t 100 t 〈 100 〉 and ｜ 1101 〈 100 〉 increases and unfavorable texture of ｜ 111 ｜ 〈 100 〉 decreases in the annealed plate.
出处
《金属热处理》
CAS
CSCD
北大核心
2013年第3期31-35,共5页
Heat Treatment of Metals
关键词
无取向电工钢
CU
表层织构
non-oriented electrical steel
copper
surface texture
