摘要
纯铜表面预镀Ni,随后采用料浆包渗法,以SiO2粉为Si源,纯Al粉为还原剂,NaF和NH4Cl作为复合活化剂,Al2O3为惰性添加剂,蛋白质(鸡蛋清)为黏结剂,在Cu表面预先镀Ni层随后料浆包渗制备渗层。研究了包渗温度对渗Si层组织和力学性能的影响。结果表明:随包渗温度的增加,渗层组织出现以下转变:Ni31Si12→Ni31Si12+Ni2Si→Ni31Si12+Ni2Si+NiAl,包渗过程由渗Si为主转变为Si-Al为主;渗层硬度降低;摩擦因数由750℃时的0.17增加到950℃时的0.33。
Abstract： A layer of electroplating nickel was deposited on copper specimens. Subsequently, these electroplated specimens were silieonized under different packing temperature for a period of 12h by slur- ry pack cementation process. A slurry pack cementation mixture was composed of SiO2 used as sili- conizing source, pure A1 powder as reducer, a dual activator of NaF ＋ NH4C1 and albumen （egg white） as cohesive agent. The effect of packing temperature on the microstructure and the mechanical properties of the siliconized coating have been studied. The results showed that the microstructure of the coating is mainly depended upon the packing temperature. As temperature increased during the slurry pack cementation process, the phases of the coating were transformed from Ni31 Si12 to Ni31 Si12 ＋Ni2Si, and to Ni31Si12 ＋Ni2Si ＋NiA1, correspondingly, and the process of slurry pack cementation were also changed from the siliconizing-base dual process to the aluminizing-base dual process; the mi- crohardness decreased and the friction coefficient of siliconized coating increased from 0. 17 to 0.33 with increasing the packing temperature from 750℃to 950℃.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2013年第2期69-73,共5页
Journal of Materials Engineering
基金
南京工程学院博士启动基金资助项目(YKJ201203)
