摘要
基于集成LC绕组结构的电磁干扰(EMI)滤波器已成功实现,但元件寄生参数影响高频噪声抑制。提出对原有接地绕组布局优化设计,消除共模(CM)绕组的寄生电容(EPC),进而改善高频性能。通过等效电路分析了消除绕组寄生电容的物理机理,并得出消除寄生电容时接地绕组布局所满足的物理模型。用Pspice软件系统地分析了耦合系数对高频性能的影响。该技术不需要引入额外的元器件。测试结果验证了其有效性。
The integrated electromagnetic interference （EMI） filter has been developed based on the low-pass filter configuration of the integrated LC hybrid structure. However, the noise suppression at high frequencies is usually compromised due to the ex- istence of parasitic components. In this study, the equivalent parallel capacitance （EPC） of common mode （CM） inductor is effec- tively cancelled only by appropriately modifying grounding layer. To demonstrate the general cancellation mechanism, a simplified equivalent circuit is firstly derived. The winding configuration is then systematically analyzed and main influence factors in imple- mentation are also investigated by using Pspice software. Applying this method, no extra components are needed in filter design compared to former methods. Finally, experimental results confirm the effectiveness of the proposed technology.
出处
《中国科技论文》
CAS
北大核心
2013年第1期5-9,共5页
China Sciencepaper
基金
国家自然科学基金资助项目(61071056)
高等学校博士学科点专项科研基金资助项目(20090172120009)
关键词
电磁兼容
集成EMI滤波器
共模
寄生电容
耦合
EMC
integrated EMI filter
common mode
parasitic capacitance
mutual coupling
