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一种双极板结构数字微流控芯片研制

Development of a Double-Plate Digital Microfluidics Chip
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摘要 基于介电润湿研制了一种将零电极布局为介电层表面的双极板结构数字微流控芯片。为了降低驱动电压并提高介电层的抗击穿能力,将介电层设计为Si3N4-SiO2层状复合结构。30V直流电压作用下,成功实现了对0.5μL去离子水微液滴的连续输运操控;且在100V以内电压作用时,均未出现介电层击穿。实验结果表明所研制数字微流控芯片可行。 An electrowetting on dielectric(EWOD) based double-plate digital microfluidics chip, in which the ground line was designed between the dielectric layer and hydrophobic layer,was developed in this paper. In order to decrease the driving voltages and enhance the dielectric anti-puncture capacity, a Si3 N4-SiO2 lamellar composite dielectric layer structure of digital microfluidics was designed. Experimental results show that a 0.5μ L of deionized water droplet was transported back and forth under 30 V dc voltages,and the dielectric layer breakdown was not observed within 100V dc voltages. It was testified that our EWOD based digital microfluidics chip was feasible.
出处 《压电与声光》 CSCD 北大核心 2013年第1期85-89,共5页 Piezoelectrics & Acoustooptics
基金 国家“八六三”计划基金资助项目(2009AA043703)
关键词 数字微流控芯片 微液滴 介电润湿 微机械加工 digital microfluidics chip droplets EWOD micro mechanical processing
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参考文献11

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