摘要
从专利分析的视角对基板上直接固定芯片(Chips on baord,COB)集成封装发光二极管(LED)技术进行分析介绍,从专利历年申请数量趋势分析、技术构成及专利申请/专利权人构成分析等几个方面对COB技术的专利布局情况进行系统总结,并简介一些重要的相关专利。
The packaging technology of Chip-on-Board multi-chips integrated LED is presented by analy- zing LED patents. The distribution of Chip-on-Board technology is systematically summarized with the study of trend of patents, constituency analysis of Chip-on-Board technology, constituency analysis of applicants/assign- ee, and several important patents about LED are also introduced.
出处
《信息化研究》
2012年第5期11-15,共5页
INFORMATIZATION RESEARCH
