摘要
热设计是电子设备可靠性的设计要求。分析了热产生的机理，并提出了电子设备的热设计方法。
Heat design is required in the reliability design. In this article, heat treatment methods of electronic equipment were presented.
出处
《电子产品可靠性与环境试验》
2000年第4期15-17,共3页
Electronic Product Reliability and Environmental Testing
