摘要
以4,4’-二氨基二苯醚(ODA)和3,3,4,4’-二苯甲酮四酸二酐(BTDA)为单体,以正硅酸乙酯和钛酸丁酯为SiO2和TiO2的前驱体,采用溶胶-凝胶原位生成法制备了聚酰亚胺(PI)复合薄膜。采用红外光谱(FT-IR)、扫描电镜(SEM)、X射线衍射(XRD)和紫外分光光度计(UV-Vis)对复合材料进行结构表征和性能测试。结果表明,复合膜的热亚胺化反应完全;纳米SiO2、TiO2均匀分散于PI基体中;复合膜透明性好,对紫外光吸收较好。热重分析(TG)和介电性能测试表明,得到了一种热稳定性好、介电性能优良的复合材料,能够满足其在微电子器件领域的使用要求。
Polyimide/SiO2-TiO2 composite films with different molar ratio of inorganic nanoparticle were prepared using tetraethoxysilane and tetrabutyl titanate as the precursor by the sol-gel method. Chemical structure, morphology and other properties Of composite films were studied by means of SEM, IR, XRD, UV-vis and TGA, the dielectric constant was also tested. The results indicate that preparation of polyimide/SiO2-TiO2 is succeeded, inorganic nanoparticles distribute uniformly in the polyimide matrix and the nanoparticles size is uniformly about 75 nm. The composite films are transparent and the ultraviolet light can be well absorbed. The composite films have the low dielectric constant, good thermal property and are insensitive to the electric field frequency.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2012年第11期153-157,共5页
Polymer Materials Science & Engineering
基金
湖南省自然科学基金资助项目(10JJ5057)
