摘要
通过对细间距SMD焊接强度试验 ,分析了影响焊接强度的诸多因素 ,找到适合SMT要求的焊膏、模板、焊膏量、温度曲线等系列工艺材料参数。
Analyze various effective factors on soldering strength of fine pitch SMD through the experiment.Find out a series of processing material and technology parameter which can meet SMT requirement,such as solder paste,stencil,soldering-paste thickness,temperature-time curve.
出处
《电子工艺技术》
2000年第4期144-146,共3页
Electronics Process Technology
